Surface modifications of epoxy resins to improve the adhesion towards electroless deposited copper
Institution: | Ghent University |
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Department: | |
Year: | 2015 |
Keywords: | Technology and Engineering; electroless copper; adhesion; polydopamine; Surface modification; epoxy resin |
Record ID: | 1075336 |
Full text PDF: | http://hdl.handle.net/1854/LU-5913963 |