AbstractsEngineering

The ever increasing circuit density of Integrated Circuits IC newlinewith higher clock frequency generates heat in the electronics system chip newlineThe lifetime of electronic components are shortened by the extended use of newlinethem at higher temperatures hence the reliability of the electronic packages newlineare reduced By creating a suitable path to transfer the generated heat to newlineambient the system will be saved from failures like catastrophic thermal newlinefailures which is also called as the total loss of electronic function of a newlinespecific component To improve the amount of heat transfer to the ambient newlinegenerally the chips are mounted on the flat plate heat sinks These heat sinks newlinetransfers the generated heat into the ambient As the power density of the chip newlineare increasing multifold in recent years the heat sinks are provided with fan newlineto achieve higher rate of heat transfer by forced convection Due to the newlineproximity of the heat sink with the ICs the Radio Frequency RF fields newlinecreated in the IC gets coupled to the heat sinks The fins of the heat sink newlineeffectively behave as monopoles at high frequencies Hence the coupled RF newlinecurrent can cause electromagnetic radiated emission This radiated noise from newlinethe device interferes with the functioning of the nearby electronic systems and newlineposes a problem to the system compliance with respect to Electromagnetic newlineInterference Electromagnetic Compatibility EMI EMC regulations Various newlinetechniques are practiced by the EMC engineers to suppress the radiated newlineemission but reducing the emission from the source point is mostly preferred newline newline%%%reference p97-102.